Characterization and Properties of Copper-Silica Sand Nanoparticle Composites

Copper-based microcomposites fabricated by powder metallurgy with subsequent plastic
deformation have received increasing attention over recent years. These microcomposites possess
good electrical conductivity in combination with high mechanical properties. The present study
aims to explore potential technical merits in developing a prealloyed powder metallurgy copper
based composites with silica sand nanoparticles reinforcement. Relevant mechanical properties and
electrical conductivity improvements are the main targets. A copper based composite with 5, 10, 15
and 20 wt.% of silica sand nanoparticles were developed through the powder metallurgy process. It
was observed that by addition of silica sand nanoparticles with 20% increased the hardness up to
143HV. Optimum electrical conductivity of the composites was achieved in the 15 wt.% silica sand
nanoparticles. Advanced particle rearrangement mechanism due to homogeneous and fine
distribution of silica sand nanoparticles into pore sites of the composites was also observed. The
silica sand nanoparticles composites properties that are much more surface-related seen to be
improved convincingly compared with the bulk controlled.