Scholarly PublicationTing, Mei Shang and Lee, Sheng Chyan and Sebastian , Patrick (2010) Signal Integrity Analysis for High Speed Digital Circuit. In: 2010 International Conference on Intelligent and Advanced Systems, 15-17 June 2010, Kuala Lumpur.
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Abstract
This paper presents a study on various signal
integrity (SI) issues that could affect signals on
Printed Circuit Boards (PCBs). This paper is aimed
to analyze and have a better understanding on the
nature of signal integrity, how the problem is
manifested in PCB designs and what design solutions
can be employed to minimize its effects. The PCB
designs are modelled using the Advanced Design
System (ADS). PCB fabrication and testing on the
Digital Communication Analyzer (DCA) follows up
and the results obtained coincide with theoretical
claims obtained at the initial stage of this paper.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Departments / MOR / COE: | Departments > Electrical & Electronic Engineering |
| Depositing User: | Patrick Sebastian |
| Date Deposited: | 20 Dec 2010 06:46 |
| Last Modified: | 19 Jan 2017 08:23 |
| URI: | http://scholars.utp.edu.my/id/eprint/3389 |
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