An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study

Hoe, H.K. and Prakash, J. and Kamaruddin, S. and Seng, O.K. (2019) An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study. Journal of Industrial Engineering and Management, 12 (2). pp. 340-355.

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Item Type:	Article
Impact Factor:	cited By 0
Depositing User:	Ms Sharifah Fahimah Saiyed Yeop
Date Deposited:	27 Aug 2021 09:05
Last Modified:	27 Aug 2021 09:05
URI:	http://scholars.utp.edu.my/id/eprint/25242

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